Soldering method, soldering device, bonding method, bonding device, and nozzle unit

A soldering method for soldering an electronic component to a substrate, comprising the steps of:

• holding a solid solder member at a position spaced apart vertically upwards by a predetermined distance from a soldering position where the electronic component and the substrate are soldered to each other;
• releasing the holding to cause the solder member to fall toward a predetermined position on the substrate, which is situated vertically below the solder member;
• and
• heating the solder member by applying heat radiation to impart heat to the solder member,
• wherein the solder member existing in air is heated after releasing the holding to thereby solder the electronic component to the substrate.

A soldering method for soldering an electronic component to a substrate, comprising the steps of:

• holding a solid solder member at a position spaced apart vertically upwards by a predetermined distance from a soldering position where the electronic component and the substrate are soldered to each other;
• releasing the holding to cause the solder member to fall toward a predetermined position on the substrate, which is situated vertically below the solder member;
• and
• heating the solder member by imparting heat radiation to the solder member,
• wherein the solder member is released by synchronizing the step of releasing and the step of heating, and wherein the solder member existing in air is heated to thereby solder the substrate and the electronic component to each other at the soldering position.

A soldering device for soldering an electronic component to a substrate, comprising:

• holding/releasing means for holding a solid solder member at a position spaced apart vertically upwards by a predetermined distance from a soldering position where the electronic component and the substrate are soldered to each other and for releasing the holding to cause the solder member to fall onto the substrate, which is situated vertically below the solder member;
• heating means for heating the solder member by applying heat radiation to impart heat to the solid solder member;
• and
• control means for synchronizing the releasing of the holding by the holding/releasing means and the heating by the heating means,
• wherein the holding of the solder member is released and the solder member existing in air is heated to thereby solder the electronic component and the substrate to each other at the soldering position.

A bonding method for bonding a first member to a second member, comprising the steps of:

• holding a solid bonding member at a position spaced apart by a predetermined distance from a bonding position where the first member and the second member are bonded to each other;
• releasing the holding of the bonding member;
• ejecting the solid bonding member onto the bonding position;
• and
• heating the bonding member by applying heat radiation to impart heat to the bonding member,
• wherein the bonding member is heated after being released to bond the first member to the bonding position on the second member.

A bonding device for bonding an electronic component to a substrate, comprising:

• holding/releasing means for releasably holding a solid bonding member at a position spaced apart by a predetermined distance from a bonding position on the substrate to which the electronic component is bonded;
• ejecting means for ejecting the bonding member onto the bonding position;
• heating means for heating the bonding member by applying heat radiation to impart heat to the bonding member;
• and
• control means for synchronizing releasing of the holding by the holding/releasing means and the heating by the heating means,
• wherein, after releasing the holding of the bonding member by the control means, the bonding member is heated to thereby bond the electronic component to the bonding position on the substrate.