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US 2006/0219757 A1Published application
Method for producing cure system, adhesive system, and electronic device
AssigneeGeneral Electric Company
InventorSlawomir Rubinsztajn
Life of this patent
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Abstract
A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided, and an associated method. A device including the cured adhesive system is provided.
Claims27
A method of producing a cure system, comprising:
- mixing a curing agent that is a low temperature liquid and a finely divided refractory solid, wherein the refractory solid is non-reactive with the curing agent.
A method, comprising:
- dispersing a compatibilized and passivated refractory solid into a mixture or solution of a low temperature liquid curing agent and a low boiling solvent, wherein the solvent is free of hydroxyl-groups and the curing agent does not react with the solid;
- and
- removing the solvent from the mixture or solution to form a solvent-free liquid dispersion of curing agent and refractory solid.
A system, comprising:
- means for securing a chip to a substrate;
- means for curing the securing means;
- and
- means for matching the coefficient of thermal expansion of the securing means to one or both of the chip or substrate, wherein the matching means is dispersed in the curing means.
1 more element
Dependencies are inferred from the claim text.