Bonding wire cleaning unit and method of wire bonding using same
OwnerHorst Clauberg, Ronald Focia +2inventors
InventorsHorst Clauberg, Ronald Focia, David Beatson, Kenneth Dury
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Abstract
A wire cleaning system for cleaning wire configured to be wirebonded is provided. The wire cleaning system includes a chamber through which a wire configured to be wirebonded extends prior to the wire being wirebonded. The wire cleaning system also includes an energy source for removing contamination from the wire in the chamber prior to the wire being wirebonded.
Claims24
A wire cleaning system for cleaning wire configured to be wirebonded, the wire cleaning system comprising:
- a chamber through which a wire configured to be wirebonded extends prior to the wire being wirebonded;
- and
- an energy source for removing contamination from the wire in the chamber prior to the wire being wirebonded.
A wire bonding machine comprising:
- a wire bonding tool configured to receive a wire to be bonded to a location;
- and
- a wire cleaning system for cleaning the wire prior to the wire being bonded to the location, the wire cleaning system including:
- (1) a chamber through which the wire extends prior to the wire being bonded to the location, and (2) an energy source for removing contamination from the wire in the chamber prior to the wire being bonded to the location.
A method of bonding a wire between a conductive pad of a semiconductor device and a conductive pad of a substrate, the method comprising the steps of:
- removing contamination from the wire prior to bonding the wire between the conductive pad of the semiconductor device and the conductive pad of the substrate;
- and
- bonding the wire between the conductive pad of the semiconductor device and the conductive pad of the substrate.
Dependencies are inferred from the claim text.