Fabrication process of semiconductor device and polishing method
AssigneeFujitsu Limited
InventorTetsuya Shirasu
Life of this patent
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Abstract
A method of fabricating a semiconductor device includes a polishing process of a substrate, wherein the polishing process includes the steps of applying a chemical mechanical polishing process to the substrate on a polishing pad while using slurry, and conditions a surface of the polishing pad, the conditioning step including the step of grinding the surface of said polishing pad by at least first and second conditioning disks of respective, different surface states.
Claims31
A method of fabricating a semiconductor device including a polishing process of a substrate, said polishing process comprising the steps of:
- applying a chemical mechanical polishing process to said substrate on a polishing pad while using slurry;
- and
- conditions a surface of said polishing pad,
- said conditioning step comprising the step of grinding said surface of said polishing pad by at least first and second conditioning disks of respective, different surface states.
A polishing method comprising the steps of:
- polishing an object on a polishing pad by using slurry;
- and
- conditioning a surface of said polishing pad,
- said step of conditioning comprising the step of grinding said surface of said polishing pad by using at least first and second conditioning disks of different surface states.
The method of fabricating a semiconductor device including the step of polishing a substrate, said step of polishing said substrate comprising the step of:
- planarizing projections and depressions on a surface of said substrate by a chemical mechanical polishing process conducted on a polishing pad while using slurry,
- wherein a polishing pad of foam-free structure is used for said polishing pad, and
- wherein slurry capable of suppressing polishing of a depressed part is used for said slurry.
A polishing apparatus, comprising:
- one or more polishing platens each rotated and carrying a polishing pad thereon;
- a substrate carrier provided in correspondence to each said polishing platen, said substrate carrier holding a substrate to be processed and urging said substrate to said polishing pad while rotating said substrate;
- and
- a slurry supply mechanism supplying slurry to each said polishing pad,
- at least first and second conditioners cooperating with each said polishing pad, each said conditioner holding a conditioning disk conditioning said polishing pad,
- each said conditioner urging said conditioning disk to said polishing pad while rotating said conditioning disk.
Dependencies are inferred from the claim text.