Method of fabricating printhead IC to have displaceable inkjets

A method of fabricating an inkjet printhead integrated circuit comprising the steps of:

• etching a circuitry layer to define first regions;
• depositing a thermally expandable material over the circuitry layer and the first regions;
• etching the thermally expandable material and the circuitry layer to define second regions having via holes;
• forming heaters at the second regions electrically contacting the circuitry layer through the via holes;
• depositing thermally expandable material on the heaters;
• forming a nozzle at each second region by etching the thermally expandable material to define an arm suspended at one end from the circuitry layer and an inkjet port in the suspended end of the arm, each arm being formed to have one of the heaters embedded in the thermally expandable material such that uneven expansion is caused upon heating resulting in displacement of the arm and associated inkjet port relative to the circuitry layer;
• and
• forming channels aligned with the nozzles by etching a substrate carrying the circuitry layer.