Conductivity sensor and manufacturing method therefor
AssigneeRosemount Analytical Inc.
InventorChang-Dong Feng
Life of this patent
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Abstract
A contacting-type conductivity sensor includes a plurality of electrodes disposed on a distal surface of a substrate. The substrate includes a plurality of vias through which electrical interconnection to the electrodes is accomplished. The conductivity sensor can employ two or four electrodes and may have a temperature sensitive element disposed on the distal surface. The electrodes may be patterned or otherwise deposited using semiconductor processing techniques.
Claims19
A fluid conductivity sensor comprising:
- an inorganic substrate having a distal, fluid contacting surface, and a proximal surface, the substrate defining a plurality of vias extending from the distal surface to the fluid contacting surface, wherein each via contains a metal therein extending from the distal surface to the proximal surface;
- a plurality of electrodes disposed on the distal surface;
- and
- a plurality of electrical interconnects extending beyond the proximal surface, wherein each interconnect is electrically coupled to an electrode through a respective via.
A fluid conductivity sensor comprising:
- an inorganic substrate having a distal, fluid contacting surface, and a proximal surface, the substrate defining a plurality of vias extending from the distal surface to the fluid contacting surface;
- a plurality of electrodes disposed on the distal surface;
- and
- a plurality of electrical interconnects each interconnect being coupled to a respective electrode and extends through a respective via.
A method of constructing a contacting-type conductivity sensor, the method comprising:
- providing a substrate having a distal surface and a proximal surface;
- generating a plurality of vias through the substrate from the distal surface to the proximal surface;
- depositing a conductive metal in each via extending from the distal surface to the proximal surface;
- generating a plurality of electrodes on the distal surface, wherein each electrode is electrically coupled to a respective metalized via;
- and
- coupling an interconnect to each metalized via.
Dependencies are inferred from the claim text.