System and method of transporting and providing a cathode contact to articles in an electroplating system

A method of electroplating articles, comprising:

• transporting said one or more articles into an electroplating cell by an electrically conductive, movable support structure, wherein said articles make contact with a plating fluid bath formed within said electroplating cell;
• providing a cathode potential to said articles by way of said electrically conductive, movable support structure;
• and
• energizing an anode electrode situated within said plating fluid bath to form a plating current through said articles.

An electroplating system, comprising:

• an electroplating cell including a container to support a plating fluid bath and an anode electrode situated within said container;
• a transport system adapted to transport articles through said plating fluid bath;
• and
• a cathode contact system comprising an electrically-conductive moving structure adapted to make electrical contact with said articles and to move substantially in synchronous with said articles.

A method of electroplating articles, comprising:

• transporting said articles into an electroplating cell by a transport system, wherein said articles make contact with a plating fluid bath formed within said electroplating cell;
• providing a cathode contact to said articles with an electrically-conductive structure that moves substantially in synchronous with said articles;
• and
• energizing an anode electrode situated within said plating fluid bath to form a plating current through said articles.

A method of electroplating articles, comprising:

• placing a plurality of articles onto a base of carrier with a cover in a first position;
• moving said cover of said carrier from said first position to a second position whereat said cover provides a cathode contact to said articles;
• transporting said carrier into an electroplating cell, wherein said articles make contact with a plating fluid bath formed within said electroplating cell;
• and
• energizing an anode electrode situated within said plating fluid bath to form a plating current through said articles.