Multilayer wiring board and its manufacturing method
AssigneeFujitsu Limited
InventorsMasamitsu Ikumo, Tadahiro Okamoto, Eiji Watanabe
Life of this patent
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Abstract
A multilayer wiring board comprises a plurality of wiring boards in which wiring layers and resin layers in each wiring board are alternately arranged in a laminated formation. In the multilayer wiring board, all the resin layers and the wiring layers, except a resin layer in the plurality of wiring boards, are separated in a same position between the plurality of wiring boards and the resin layer is continuous in the same position.
Claims20
A multilayer wiring board, comprising:
- a plurality of wiring boards in which wiring layers and resin layers in each wiring board are alternately arranged in a laminated formation,
- wherein all the resin layers and the wiring layers, except a resin layer in the plurality of wiring boards, are separated in a same position between the plurality of wiring boards and the resin layer is continuous in the same position.
A manufacturing method of a multilayer wiring board having a plurality of wiring boards in which wiring layers and resin layers in each wiring board are alternately arranged in a laminated formation, the manufacturing method comprising steps of:
- forming a first resin layer and a first wiring layer on a supporting board;
- forming a second resin layer and a second wiring layer on the first resin layer;
- forming two or more additional resin layers and two or more additional wiring layers on the second resin layer alternately, so that all the resin layers and the wiring layers, except a resin layer in the plurality of wiring boards, are separated in a same position between the plurality of wiring boards;
- and
- removing the supporting board.
A manufacturing method of a multilayer wiring board having a plurality of wiring boards in which wiring layers and resin layers in each wiring board are alternately arranged in a laminated formation, the manufacturing method comprising steps of:
- forming a first wiring layer and a first resin layer on a supporting board separately;
- forming a second wiring layer on the first resin layer and forming a second resin layer on both the second wiring layer and the first resin layer;
- forming two or more additional wiring layers and two or more additional resin layers alternately on the second resin layer so that all the resin layers and the wiring layers, except a resin layer in the plurality of wiring boards, are separated in a same position between the plurality of wiring boards;
- and
- removing the supporting board.
Dependencies are inferred from the claim text.