System and method for increasing wiring channels/density under dense via fields
AssigneeInternational Business Machines Corporation
InventorsAnand Haridass, Dierk Kaller, Erich Klink, Gisbert Thomke
Life of this patent
Estimating the term…
Abstract
A system and method for increasing the wiring channels/density under dense via fields of a circuit board are provided. With the system and method, the power/ground lines for the circuit board are designed to be provided in an orthogonal or diagonal pattern. The land grid array (LGA)/ball grid array (BGA) makes contact only on the surface pads of the printed circuit board with no plated through holes/vias underneath these surface pads. This opens up wiring channels, which previously used to be occupied by plated through holes and anti-pads, that can now be used for maximizing signal line wiring routing.
Claims18
A method of fabricating a circuit board, comprising:
- receiving an initial circuit board design;
- creating a pattern of surface pads associated with power/ground lines whose vias are to be removed;
- removing vias, associated with the pattern of surface pads, in the initial circuit board design;
- optimizing signal wire routings to utilize space freed by the removal of the vias associated with the pattern of surface pads, thereby generating an optimized circuit board design;
- and
- fabricating the circuit board based on the optimized circuit board design.
A system for fabricating a multi-layered ceramic package, comprising:
- a circuit board design system that provides an initial circuit board design;
- a power/ground line engine that creates a pattern of surface pads associated with power/ground lines whose vias are to be removed and removes vias associated with the pattern of surface pads in the initial circuit board design;
- a wire routing optimization engine that optimizes signal wire routings to utilize space freed by the removal of the vias associated with the pattern of surface pads, thereby generating an optimized circuit board design;
- and
- a circuit board fabrication system that fabricates the circuit board based on the optimized circuit board design.
A circuit board, comprising:
- a plurality of surface pads of an area array;
- a plurality of plated through holes associated with a first subset of the plurality of surface pads;
- and
- a plurality of signal wires in a layer of the circuit board, wherein a second subset of the plurality of surface pads are assigned to power/ground wires and wherein the second subset of the plurality of surface pads exist as surface pads only with no associated vias, and wherein a subset of signal wires of the plurality of signal wires pass through an area beneath the second subset of surface pads assigned to power/ground wires where associated vias would have been.
Dependencies are inferred from the claim text.