Protective tape cutting method and apparatus using the same
AssigneeNitto Denko Corporation
InventorsNorio Mori, Masayuki Yamamoto
Life of this patent
Estimating the term…
Abstract
A cutter blade cooling part is operated by a first temperature control part to regulate a temperature and flow amount of cooled air blown on a cutter blade and heating of the cutter blade by an electrothermal heater. Thus, a protective tape is cut while the temperature of the cutter blade is maintained at a temperature equal to or less than room temperature.
Claims17
A method for cutting a protective tape joined to a surface of a semiconductor wafer formed with a pattern by moving a cutter blade along an outer periphery of the semiconductor wafer, the method comprising the step of:
- cutting the protective tape while cooling the cutter blade with cooling means.
A method for cutting a protective tape joined to a surface of a semiconductor wafer formed with a pattern by moving a cutter blade along an outer periphery of the semiconductor wafer, the method comprising the step of:
- cutting the protective tape while cooling the protective tape with cooling means.
An apparatus for cutting a protective tape joined to a surface of a semiconductor wafer formed with a pattern, the apparatus comprising:
- holding means on and at which the semiconductor wafer is mounted and held;
- protective tape joining means for joining the protective tape onto the surface of the semiconductor wafer mounted on and held at the holding means;
- protective tape cutting means having a cutter blade, and allowing the cutter blade to penetrate the protective tape and to move along an outer periphery of the semiconductor wafer, thereby cutting the protective tape joined to the surface of the semiconductor wafer;
- cutter blade cooling means for cooling the cutter blade of the protective tape cutting means;
- and
- tape collecting means for collecting an unnecessary protective tape after cutting.
An apparatus for cutting a protective tape joined to a surface of a semiconductor wafer formed with a pattern, the apparatus comprising:
- holding means on and at which the semiconductor wafer is mounted and held;
- protective tape joining means for joining the protective tape onto the surface of the semiconductor wafer suction-held by the holding means;
- protective tape cutting means having a cutter blade, and allowing the cutter blade to penetrate the protective tape and to move along an outer periphery of the semiconductor wafer, thereby cutting the protective tape joined to the surface of the semiconductor wafer;
- tape cooling means for cooling the protective tape;
- and
- tape collecting means for collecting an unnecessary protective tape after cutting.
Dependencies are inferred from the claim text.