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US 2006/0219351 A1Published application
Wafer strength reinforcement system for ultra thin wafer thinning
AssigneeSTATS ChipPAC, Ltd.
InventorsHeap Hoe Kuan, Byung Tai Do
Life of this patent
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Abstract
A wafer strength reinforcement system is provided including providing a wafer, providing a tape for supporting the wafer, and positioning a wafer edge support material for location between the tape and the wafer.
Claims20
A wafer strength reinforcement system comprising:
- providing a wafer;
- providing a tape for supporting the wafer;
- and
- positioning a wafer edge support material for location between the tape and the wafer.
1 more element
A wafer strength reinforcement system comprising:
- providing a semiconductor wafer;
- providing a backgrinding tape for supporting the semiconductor wafer;
- and
- applying a paste between the backgrinding tape and the semiconductor wafer.
1 more element
Dependencies are inferred from the claim text.