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US 2006/0219268 A1Published application
Neutralization of systemic poisoning in wafer processing
OwnerGunilla Jacobsoninventor
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Abstract
A method for the pre-treatment of a wafer that has been treated to an ammonia plasma. The pre-treatment can neutralize the poisoning effects caused by the ammonia plasma, which can prevent proper etching in subsequent steps.
Claims35
A method of processing a substrate having a patterned doped layer thereon, the method comprising the steps of:
- positioning the substrate on a substrate holder in a processing chamber;
- performing an amine extraction process using a first supercritical fluid comprising supercritical CO2 and an amine extraction chemistry;
- and
- performing a rinsing process using a second supercritical fluid comprising supercritical CO2 and a rinsing chemistry.
1 more element
Dependencies are inferred from the claim text.