Method for manufacturing an electronic module
AssigneeImbera Electronics Oy
InventorsRisto Tuominen, Petteri Palm
Life of this patent
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Abstract
An electronic module and a method for manufacturing an electronic module, in which an installation base is used, which includes an insulating-material layer (1) and a conductive layer on the surface of the insulating-material layer. The conductive layer also covers the installation cavity of a component (6). The component (6) is set in the installation cavity, in such a way that the contact zones face towards the conductive layer and electrical contacts are formed between the contact zones of the component (6) and the conductive layer. After this, conductive patterns (14) are formed from the conductive layer, to which the component (6) is attached.
Claims21
A method for manufacturing an electronic module, the method comprising:
- making an installation base, which includes an insulating-material layer, in which there is at least one installation cavity for a component, and a conductive layer on the surface of the insulating-material layer, which covers the said installation cavity,
- making at least one alignment mark on the installation base,
- taking a component, which has a contacting surface, which has contact zones,
- placing the component in the installation cavity, in such a way that the contacting surface faces towards the conductive layer, and aligning the component relative to at least one alignment mark made on the installation base,
- forming electrical contacts between the contact zones of the component and the conductive layer of the installation base, and
- making conductive patterns from the conductive layer of the installation base, in such a way that the conductive patterns are aligned with the aid of at least one alignment mark made on the installation base.
Dependencies are inferred from the claim text.