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US 2006/0217499 A1Published application
Liquid epoxy resin composition and semiconductor device
AssigneeShin-Etsu Chemical Co., Ltd.
InventorHiroyuki Takenaka
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Abstract
Better semiconductor encapsulation is achieved with a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent containing at least 5 wt % of an aromatic amine compound, (C) a microencapsulated catalyst containing a phenolic hydroxy-bearing benzoic acid derivative, and optionally, (D) an inorganic filler.
Claims9
A liquid epoxy resin composition comprising
- (A) a liquid epoxy resin,
- (B) an aromatic amine curing agent, and
- (C) microcapsules containing a phenolic hydroxy-bearing benzoic acid derivative having the general formula (2):
- wherein R4, R5 and R6 are each independently selected from the group consisting of hydrogen, hydroxyl, C1-C10 alkoxy, and substituted or unsubstituted monovalent C1-C12 hydrocarbon groups which may be separated by at least one atom selected from oxygen, nitrogen, sulfur and silicon.
1 more element
Dependencies are inferred from the claim text.