Perforation and grooving for polishing articles
AssigneeApplied Materials, Inc.
InventorsShijian Li, Liang-Yuh Chen, Alain Duboust
Life of this patent
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AssigneeApplied Materials, Inc.
InventorsShijian Li, Liang-Yuh Chen, Alain Duboust
Estimating the term…
Methods, articles of manufacture, and apparatus are provided for depositing and planarizing one or more layers of material on a substrate, or combinations thereof, are disclosed. In one embodiment, an article of manufacture is provided for polishing a substrate, comprising a polishing article having a polishing surface, a plurality of perforations formed in at least a portion of the polishing article for flow of material therethrough, and a plurality of grooves disposed in the polishing surface. The article of manufacture may be used in a method for processing a substrate, comprising positioning the substrate in an electrolyte solution containing a polishing article, optionally depositing a material on the substrate by an electrochemical deposition method, and polishing the substrate with the polishing article.
An article of manufacture for depositing and planarizing a material on a substrate, comprising:
An article of manufacture for depositing and planarizing a material on a substrate, comprising:
A system for processing a substrate, comprising:
Dependencies are inferred from the claim text.