Polishing apparatus and method of polishing work piece
AssigneesToshiro Doi, Fujikoshi Machinery Corp.
InventorsToshiro Doi, Ara Philipossian, Darren DeNardis
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AssigneesToshiro Doi, Fujikoshi Machinery Corp.
InventorsToshiro Doi, Ara Philipossian, Darren DeNardis
Estimating the term…
The polishing apparatus is capable of changing a pH value of slurry to adjust polishing rate and polishing a work piece with high flatness. The polishing apparatus comprises: a pressure vessel; a polishing plate provided in the pressure vessel; a pressing plate pressing a work piece onto the polishing plate; a driving unit relatively moving the polishing plate with respect to the pressing plate so as to polish the work piece; a gas supplying source supplying an alkaline gas or an acid gas into the pressure vessel; a gas discharging section discharging the supplied gas from the pressure vessel; and a slurry supplying unit supplying slurry onto the polishing plate. A pH value of the slurry is adjusted by dissolving the alkaline gas or the acid gas in the slurry.
A polishing apparatus, comprising:
A method of polishing a work piece in a polishing apparatus comprising:
A polishing apparatus, comprising:
Dependencies are inferred from the claim text.