Electronic apparatus with jack
AssigneeOrion Electric Co., Ltd.
InventorsToshio Nishigaki, Yoshiaki Takahashi
Life of this patent
Estimating the term…
Loading patent…
AssigneeOrion Electric Co., Ltd.
InventorsToshio Nishigaki, Yoshiaki Takahashi
Estimating the term…
A grounding wire is formed by bending a conductive wire. The grounding wire includes a winding portion formed on a horizontal portion so as to be smaller in diameter than a cylindrical portion of a jack, a horizontal proximal portion in parallel to a circuit board, and a connection end bent from an end of the horizontal proximal portion and connected to a ground pattern. The winding portion of the grounding wire is expanded and outwardly engaged to the cylindrical portion of the jack, and elastically and closely attached to the cylindrical portion of the jack by an elastic restoring force of the winding portion. The connection end is then inserted into a hole formed in the circuit board and soldered onto the ground pattern of the circuit board. Static electricity, with which the jack is charged, is discharged from the grounding wire to the ground pattern.
An electronic apparatus with a jack, comprising:
Dependencies are inferred from the claim text.