Substrate processing system and method for manufacturing semiconductor device
AssigneeTokyo Electron Limited
InventorsTadahiro Ohmi, Akinobu Teramoto
Life of this patent
Estimating the term…
Abstract
An object of the present invention is to completely remove water adhering to a substrate due to cleaning and carry the substrate with the water being removed, to a film forming unit. The present invention is a substrate processing system including: a cleaning unit for cleaning a substrate with a cleaning solution; a water removing unit for removing water adhering to the substrate cleaned in the cleaning unit; and a carrier section for carrying the substrate from which water has been removed in the water removing unit to another substrate processing unit through a dry atmosphere.
Claims24
A substrate processing system, comprising:
- a cleaning unit for cleaning a substrate with a cleaning solution;
- a water removing unit for removing water adhering to the substrate cleaned in said cleaning unit;
- and
- a carrier section for carrying the substrate from which water has been removed in said water removing unit to another substrate processing unit through a dry atmosphere.
A manufacturing method of a semiconductor device for processing a semiconductor substrate through use of a substrate processing system, said system comprising a cleaning unit for cleaning a substrate with a cleaning solution;
- a water removing unit for removing water adhering to the substrate cleaned in said cleaning unit;
- and a carrier section for carrying the substrate from which water has been removed in said water removing unit to another substrate processing unit through a dry atmosphere.
Dependencies are inferred from the claim text.