Methods of depositing materials over semiconductor substrates

A method of depositing a material over a semiconductor substrate comprising:

• positioning a semiconductor substrate on a susceptor, the susceptor having at least one solid portion therethrough that is transparent to infrared radiation and over which the semiconductor substrate is received;
• depositing a material over the semiconductor substrate;
• and
• during the depositing, detecting substrate temperature by measuring substrate emissivity from a back side of the semiconductor substrate through the at least one infrared radiation transparent portion of the susceptor from a back side of the susceptor using a non-contacting emissivity sensor.

A method of depositing a material over a semiconductor substrate comprising:

• positioning a semiconductor substrate on a susceptor, the susceptor having a front substrate receiving side and a back side, the susceptor having at least one solid portion therethrough that is transparent to infrared radiation and over which the semiconductor substrate is received;
• depositing a material over the semiconductor substrate;
• and
• during the depositing, impinging radiant energy onto the susceptor back side through the transparent solid portion effective to heat the semiconductor substrate being deposited upon.

A method of depositing an elemental silicon-comprising material over a semiconductor substrate, comprising:

• positioning a semiconductor substrate on a susceptor, the susceptor having a front substrate receiving side face and a back side face, the susceptor comprising a ring having a radial inner portion at least a radial majority of which is non-solid space extending from the front side face to the back side face, the semiconductor substrate comprising a front side and a back side;
• depositing an elemental silicon-comprising material at least on the substrate front side;
• and
• during the depositing, impinging radiant energy onto the substrate back side through the radial central non-solid portion of the susceptor.

A method of depositing material over a semiconductor substrate comprising:

• positioning a semiconductor substrate on a susceptor;
• engaging a peripheral edge of the semiconductor substrate with at least three radially movable substrate edge clamps on the susceptor;
• causing the susceptor with semiconductor substrate to rotate;
• and
• depositing a material over the semiconductor substrate while the semiconductor substrate is engaged with the substrate edge clamps.

A method of depositing material over a semiconductor substrate comprising:

• positioning a semiconductor substrate on a susceptor;
• rotating the susceptor with semiconductor substrate at a rotational speed effective to cause at least three radially movable substrate edge clamps on the susceptor to engage a peripheral edge of the semiconductor substrate;
• and
• after and while engaging the peripheral edge of the semiconductor substrate with the at least three radially movable substrate edge clamps, continuing rotation of the susceptor while depositing a material over the semiconductor substrate.

A method of depositing material over a semiconductor substrate comprising:

• positioning a semiconductor substrate on a substrate bearing surface of a susceptor, the bearing surface comprising at least one vacuum opening therein;
• applying a vacuum force to the at least one opening effective to apply a pulling force on the semiconductor substrate against the bearing surface;
• and
• while the vacuum force is applied, rotating the susceptor while depositing a material over the semiconductor substrate.

A method of depositing material over a semiconductor substrate comprising:

• positioning a semiconductor substrate over a surface of a susceptor, the surface comprising at least three gas emitting openings therein;
• emitting gas from the at least three openings effective to levitate and rotate the semiconductor substrate relative to the susceptor;
• and
• while levitating and rotating the semiconductor substrate relative to the susceptor, depositing a material over the semiconductor substrate.