Package structure and fabrication thereof
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsJun-Young Yang, You-Ock Joo, Chang-Kyu Ahn, Jung-Tae Kim, Sung-Sig Kang
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Abstract
The fabrication and device of package structure with a plurality of conductive contacts are provided herein. At least one chip is attached among the conductive pads on the surface of a wafer. A number of conductive wires are attached on the conductive pads and encapsulated by a layer. The layer is removed from the top thereof until to expose the conductive contacts derived from the conductive wires.
Claims21
A fabrication of package structure with a plurality of conductive contacts, comprising:
- providing a wafer with a plurality of first conductive pads on an first active side;
- attaching a chip among said first conductive pads on said first active side;
- forming a plurality of conductive wires on said first conductive pads;
- forming an encapsulation covering said chip, said conductive wires and said wafer;
- and
- removing a portion of said encapsulation to expose said plurality of conductive contacts, wherein said conductive contacts are derived from said conductive wires.
A fabrication of stack package structure with a plurality of conductive contacts, comprising:
- providing a first semiconductor device with a plurality of first conductive pads on an active side of said first semiconductor device;
- attaching a second semiconductor device among said first conductive pads on said first semiconductor device, wherein said second semiconductor device is with a plurality of second conductive pads thereon;
- forming a plurality of conductive wires on said first conductive pads and said second conductive pads;
- forming an encapsulation covering said second semiconductor device, said conductive wires and said active side of said first semiconductor device, wherein a backside of said first semiconductor device is exposed outside of said encapsulation;
- and
- removing a portion of said encapsulation to expose said plurality of conductive contacts, wherein said conductive contacts are derived from said conductive wires.
A package structure with a plurality of conductive contacts thereon, said package structure comprising:
- a first semiconductor device with a plurality of first conductive pads on an active side;
- a second semiconductor device among said first conductive pads and attached on said active side;
- an encapsulation over said second semiconductor device and said active side;
- and
- a plurality of conductive wires in said encapsulation and contacting said first conductive pads, wherein said conductive wires have said conductive contacts exposed on said encapsulation.
(canceled)
Dependencies are inferred from the claim text.