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US 2006/0216861 A1Published application
Manufacturing method of wiring substrate
AssigneeFujitsu Limited
InventorKanae Nakagawa
Life of this patent
Estimating the term…
Abstract
After a first adhesive layer having high adhesion to a supporting base is locally formed, a second adhesive layer having low adhesion to the supporting base is formed all over the supporting base so as to cover the first adhesive layer. When a wiring structure is separated, a predetermined portion of the wiring structure where the first adhesive layer is formed is cut to thereby separate the integrated wiring structure and second adhesive layer from the first adhesive layer.
Claims16
A manufacturing method of a wiring substrate, comprising the steps of:
- forming a first adhesive layer having adhesion to a supporting base in a predetermined portion on one principal surface of the supporting base;
- forming a second adhesive layer having lower adhesion to the supporting base than the first adhesive layer on the supporting base so as to cover the first adhesive layer;
- forming a wiring structure, which is made by forming a wiring construction in an insulating layer, on the second adhesive layer;
- separating the first adhesive layer and the second adhesive layer in the predetermined portion;
- and
- separating the remaining second adhesive layer and the wiring structure as one piece from the supporting base.
3 more elements
A manufacturing method of a wiring substrate, comprising the steps of:
- forming a first adhesive layer having adhesion to a supporting base in a predetermined portion on one principal surface of the supporting base;
- forming a second adhesive layer having lower adhesion to the supporting base than the first adhesive layer on the supporting base so as to cover the first adhesive layer;
- planarizing a surface of the second adhesive layer by cutting with a tool with an other principal surface of the supporting base as a reference;
- forming a wiring structure, which is made by forming a wiring construction in an insulating layer, on the planarized second adhesive layer;
- separating the first adhesive layer and the second adhesive layer in the predetermined portion;
- and
- separating the remaining second adhesive layer and the wiring structure as one piece from the supporting base.
4 more elements
Dependencies are inferred from the claim text.