Microelectronic imaging units and methods of manufacturing microelectronic imaging units

A plurality of microelectronic imaging units, comprising:

• a support member;
• a plurality of imaging dies attached to the support member, the individual imaging dies comprising a first height, an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit;
• a base on the support member between adjacent imaging dies, the base having a second height less than or approximately equal to the first height of the dies;
• and
• a plurality of covers attached to the base and positioned over corresponding image sensors.

A plurality of microelectronic imaging units, comprising:

• a support member having a plurality of terminal arrays;
• a plurality of imaging dies attached to the support member, the individual imaging dies comprising an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit and electrically coupled to corresponding terminals on the support member;
• a footing on the support member between adjacent imaging dies and contacting a portion of the individual imaging dies;
• and
• a plurality of covers attached to the footing and positioned over corresponding image sensors.

A microelectronic imaging unit, comprising:

• a support member having an array of terminals;
• an imaging die projecting a first distance from the support member, the imaging die comprising an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit and electronically coupled to corresponding terminals on the support member;
• a base projecting a second distance from the support member, the second distance being less than or approximately equal to the first distance;
• a cover positioned over the image sensor;
• and
• an adhesive attaching the cover to the base and/or the imaging die.

A plurality of microelectronic imaging units, comprising:

• a support member having a plurality of terminal arrays;
• a plurality of imaging dies attached to the support member, the individual imaging dies comprising an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit;
• a plurality of wire-bonds having a proximal portion coupled to one of the external contacts and a distal portion coupled to a corresponding terminal;
• a footing on the support member encapsulating the distal portion of the individual wire-bonds;
• a plurality of covers positioned over corresponding image sensors;
• and
• an adhesive attaching the covers to the footing and/or corresponding imaging dies.