Mechanical quantity measuring apparatus
AssigneeHitachi, Ltd.
InventorsHisashi Tanie, Takashi Sumigawa, Hiroyuki Ohta
Life of this patent
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Abstract
A semiconductor mechanical quantity measuring apparatus in which the reverse surface of a strain-detecting semiconductor element is bonded to an object of measurement, and a member having a small elastic modulus is interposed between the wiring board for supporting the strain-detecting semiconductor element and the strain-detecting semiconductor element. It then becomes possible to reduce an undesirable effect that the rigidity and thermal deformation of the wiring board have on the strain-detecting semiconductor element, while supporting the strain-detecting semiconductor element.
Claims11
A semiconductor mechanical quantity measuring apparatus for detecting the strain of an object of measurement by coupling a first main surface of a strain-detecting semiconductor element to the object,
- wherein the strain-detecting semiconductor element is supported on a wiring board through a first elastic member on a second main surface of the strain-detecting semiconductor element, and
- wherein at least a part of the end portions of the joint between the strain-detecting semiconductor element and the first elastic member is reinforced by resin, and the first elastic member is lower in elastic modulus than the resin.
A semiconductor mechanical quantity measuring apparatus comprising:
- a strain-detecting semiconductor element having a first main surface coupled to an object of measurement and a second main surface constituting the reverse surface opposite to the first main surface;
- a first elastic member coupled to the second main surface of the strain-detecting semiconductor element;
- a wiring board coupled to the reverse surface of the first elastic member coupled to the second main surface of the strain-detecting semiconductor;
- and
- a resin member having a larger elastic modulus than the first elastic member and connecting at least a part of the ends of the joint between the strain-detecting semiconductor element and the first elastic member.
Dependencies are inferred from the claim text.