Heating apparatus, coating and development apparatus, and heating method
AssigneeTokyo Electron Limited
InventorsTetsuo Fukuoka, Takahiro Kitano, Nobuaki Matsuoka
Life of this patent
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Abstract
A heating apparatus is configured to include a hot plate at which a substrate is placed, a top plate opposed to the substrate, a gas discharging part provided on one end side of the hot plate for discharging gas between the hot plate and the top plate, an exhaust part provided to be opposed to the gas discharging part with the hot plate interposed therebetween, and a heating part independently heating a first region and a second region of the substrate. A heating process is performed with good within-wafer uniformity by forming an unidirectional flow to heat the first region and the second region at different temperatures.
Claims16
A heating apparatus performing a heating process for a coating liquid coated on a substrate, comprising:
- a hot plate at which said substrate is placed;
- a top plate for rectification provided above said hot plate to be opposed to said substrate;
- a gas discharging part provided on one end side of said hot plate for discharging gas between said hot plate and said top plate to form a gas flow having a width that can cover a width of said substrate;
- an exhaust part provided on a side opposed to said gas discharging part with said hot plate interposed to suck and exhaust said gas;
- and
- heating part provided at said hot plate and being capable of independently heating a first region at an exhaust part side in said substrate and a second region other than said first region and heating said first region at a temperature higher than said second region, wherein
- said gas flow from said gas discharging part flows from one end side to the other end side of said substrate.
A heating apparatus performing a heating process for a coating liquid coated on a substrate, comprising:
- a hot plate at which said substrate is placed;
- a top plate for rectification provided above said hot plate to be opposed to said substrate;
- a gas discharging part provided on one end side of said hot plate for discharging gas between said hot plate and said top plate to form a gas flow having a width that can cover a width of said substrate;
- an exhaust part provided on a side opposed to said gas discharging part with said hot plate interposed to suck and exhaust said gas;
- heating part provided at said top plate and being capable of independently heating a region opposed to a first region on an exhaust part side in said substrate and a region opposed to a second region other than said first region and heating said region opposed to said first region at a temperature higher than said region opposed to said second region, wherein
- said gas flow from said gas discharging part flows from one end side to the other end side of said substrate.
A heating apparatus performing a heating process for a coating liquid coated on a substrate, comprising:
- a hot plate at which said substrate is placed;
- a protrusion portion having a height of 0.3 mm to 1.0 mm provided at said hot plate for supporting said substrate in such a manner that said substrate is isolated from a surface of said hot plate;
- a top plate for rectification provided above said hot plate to be opposed to said substrate;
- a gas discharging part provided on one end side of said hot plate for discharging gas heated to a temperature within ±2% with respect to a heating temperature for said substrate between said hot plate and said top plate to form a gas flow having a width that can cover a width of said substrate;
- and
- an exhaust part provided on a side opposed to said gas discharging part with said hot plate interposed to suck and exhaust said gas, wherein
- said gas flow from said gas discharging part flows from one end side to the other end side of said substrate.
A heating method of performing a heating process for a coating liquid coated on a substrate, comprising the steps of:
- placing said substrate at a hot plate;
- discharging gas from a gas discharging part on one end side of said hot plate while sucking and exhausting gas from an exhaust part on the other end side of said hot plate thereby forming a gas flow having a width that can cover a width of said substrate, from said one end side to said other end side of said hot plate between said substrate and a top plate for rectification as opposed to said substrate;
- and
- using heating part provided at said hot plate, independently controlling heating a predetermined first region on an exhaust part side in said substrate and a second region other than said first region, and heating said first region at a temperature higher than said second region.
A heating method of performing a heating process for a coating liquid coated on a substrate, comprising the steps of:
- placing said substrate at a hot plate;
- discharging gas from a gas discharging part on one end side of said hot plate while sucking and exhausting gas from an exhaust part on the other end side of said hot plate thereby forming a gas flow having a width that can cover a width of said substrate, from said one end side to said other end side of said hot plate between said substrate and a top plate for rectification as opposed to said substrate;
- and
- using heating part provided at said top plate, independently controlling heating a region opposed to a predetermined first region on an exhaust part side in said substrate and a region opposed to a second region other than said first region, and heating said region opposed to said first region at a temperature higher than said region opposed to said second region.
A heating method of performing a heating process for a coating liquid coated on a substrate, comprising the steps of:
- placing said substrate in such a manner that said substrate is supported by a protrusion portion having a height of 0.3 mm to 1.0 mm provided on a surface of a hot plate and is isolated from said hot plate;
- and
- discharging gas heated to a temperature within ±2% with respect to a heating temperature for said substrate from a gas discharging part on one end side of said hot plate while sucking and exhausting gas from an exhaust part on the other end side of said hot plate, thereby forming a gas flow having a width that can cover a width of said substrate, from said one end side to said other end side of said hot plate between said substrate and a top plate for rectification as opposed to said substrate.
Dependencies are inferred from the claim text.