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US 2006/0216520 A1Published application
Semiconductor encapsulating epoxy resin composition and semiconductor device
AssigneeShin-Etsu Chemical Co., Ltd.
InventorShoichi Osada
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Abstract
Epoxy resin compositions comprising (A) an epoxy resin, (C) an inorganic filler, (D) a cure accelerator in the form of an addition product of tertiary phosphine and benzoquinone, (E) a maleimide compound, and (F) an alkenyl phenol are effectively moldable and cures into products having a high Tg and a low dielectric constant and are best suited for the encapsulation of semiconductor devices.
Claims3
A semiconductor encapsulating epoxy resin composition comprising
- (A) an epoxy resin,
- (C) an inorganic filler,
- (D) a cure accelerator having the general formula (1):
- wherein R1, R2, and R3 are each independently hydrogen, C1-C4 alkyl, aryl, or hydroxyl, and R4 to R18 are each independently hydrogen, C1-C4 alkyl or alkoxy.
- (E) a compound having at least two maleimide groups in a molecule, and
- (F) a phenol having at least one alkenyl group in a molecule.
3 more elements
Dependencies are inferred from the claim text.