Resin composition for printed wiring board, prepreg laminate, and printed wiring board made with the same

A process for producing a printed wiring board, which comprises the following steps:

• (1) preparing a prepreg for a printed wiring board, by preparing a varnish of said epoxy resin composition with an organic solvent, impregnating the varnish into a glass cloth, and drying it in an oven to make it into a semi-cured state (B-stage);
• wherein said epoxy resin composition comprises an epoxy resin, a phenol novolac resin, a curing accelerator, and a silica filler having a shape having at least two planes and having an average particle diameter between 0.3 □ and 10□ and a relative surface area between 8 m2/g and 30 m2/g;
• (2) manufacturing a laminated board for a printed wiring board, by stacking a prescribed number of sheets of said prepreg and hot-pressing them through laminate molding, and placing a metal foil on one or both sides of the prescribed number of the prepreg sheets stacked for printed wiring board and laminate-molded to yield a metal foil-clad laminated board;
• and
• (3) forming a circuit on an outer layer of the laminated board for printed wiring board to yield a printed wiring board.