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US 2006/0215951 A1Published application
Fabricating a photonic die
AssigneeHewlett-Packard Development Company, L.P.
InventorsChien-Hua Chen, Robert Bicknell
Life of this patent
Estimating the term…
Abstract
In one embodiment, a method includes forming an array of recesses in a substrate, depositing spacer material in the recesses, forming photonic elements on the spacer material, and separating the structure previously formed into individual dies that each include a photonic element, spacer material and substrate.
Claims28
A method, comprising:
- forming an array of recesses in a substrate;
- suspending a photonic element on conductive leads across each recess;
- and
- separating a structure previously formed into individual dies that each include a photonic element, conductive leads and a portion of the substrate.
1 more element
8-10. (canceled)
A method, comprising:
- forming light emitting photonic elements on a substrate transparent to light emitted by the photonic elements;
- forming conductive leads on the substrate in electrical contact with the photonic elements;
- separating a structure previously formed into individual dies that each include a photonic element, a portion of the substrate and conductive leads;
- suspending each die in a transparent housing;
- and
- connecting the leads on each die to conductors that protrude from the housing.
3 more elements
A method, comprising:
- forming an array of recesses in a transparent substrate;
- depositing spacer material in each recess;
- forming a light emitting photonic element on the spacer material in each recess;
- forming conductive leads on the substrate in electrical contact with the photonic elements;
- separating a structure previously formed into individual dies that each include a photonic element, spacer material, a portion of the substrate and conductive leads extending from the photonic element to the substrate;
- connecting the leads on each die to conductors;
- suspending each die on the conductors;
- and then
- removing spacer material from the recesses.
6 more elements
(canceled)
A photonic die assembly, comprising:
- a photonic die comprising
- a substrate having a recess therein,
- spacer material in the recess,
- a light emitting photonic element supported on the spacer material, the recess surrounding the photonic element in a plane along a surface of the substrate, the substrate transparent to light emitted by the photonic element, and
- conductive leads along the surface of the substrate, the leads in electrical contact with the photonic element;
- and
- conductive posts mounting the photonic die, each post contacting a different lead and the photonic element suspended between the posts.
4 more elements
(canceled)
A photonic die, comprising:
- a transparent substrate having a recess therein;
- conductive leads along a surface of the substrate;
- and
- a light emitting photonic element supported on the conductive leads across the recess.
1 more element
A photonic light bulb, comprising:
- a die comprising a transparent substrate, conductive leads along a surface of the substrate, and a light emitting photonic element supported on the conductive leads across a recess in the substrate;
- conductive posts mounting the die, each post contacting a different lead and the photonic element suspended between the posts;
- and
- a transparent housing enclosing the die and only part of the posts such that the posts protrude from the housing, the die suspended within the housing on the posts.
1 more element
Dependencies are inferred from the claim text.