Direct backlight module
AssigneeAu Optronics Corporation
InventorsShin-Li Chen, Chung-Te Lee
Life of this patent
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Abstract
A direct backlight module at least includes a light-source, a substrate, a heat source and-a heat-pipe, wherein the heat source comprises a PCB, an inventer, and a power supply. The light-source is disposed on the substrate. A bottom surface of the substrate is divided into a first predetermined portion and a second predetermined portion. The PCB is disposed in the first predetermined portion. The light-source is electrically connected with the PCB. The heat-pipe is disposed on the bottom surface of the substrate to transfer heat from the first predetermined portion to the second predetermined portion, such that the temperature distribution of the direct backlight module can be more evenly.
Claims19
A direct backlight module, comprising:
- a light source;
- a substrate disposed on the substrate, a bottom surface of the substrate being divided into a first predetermined portion and a second predetermined portion;
- a heat source disposed on the first predetermined portion and electrically connecting with the light source;
- and
- at least a heat-pipe disposed on the bottom surface of the substrate to transfer heat from the first predetermined portion to the second predetermined portion.
A method of assembling a direct backlight module, comprising:
- providing a substrate, wherein a bottom surface of the substrate is divided into a first predetermined portion and a second predetermined portion;
- disposing a heat-pipe on the bottom surface of the substrate;
- and
- disposing a printed circuit board on the first predetermined portion.
Dependencies are inferred from the claim text.