Flexible circuit substrate and method of manufacturing the same
AssigneeShinko Electric Industries Co., Ltd.
InventorsTomohiro Nomura, Kazunori Abe, Shozo Yamamuro
Life of this patent
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Abstract
A wiring layer forming wirings containing inner leads and outer leads are formed on a flexible substrate. Then, inner lead reinforcing electrodes to which a semiconductor chip is connected are formed on the inner leads, outer lead reinforcing electrodes are formed on the outer leads, and wiring reinforcing portions are formed between the inner leads and the outer leads on the wiring layers. The flexible substrate is mounted onto an electronic device by folding a portion to which the wiring reinforcing portions are provided between the inner leads and the outer leads.
Claims9
A flexible circuit substrate, comprising:
- a flexible substrate;
- a wiring layer formed on the flexible substrate and forming wirings including inner leads and outer leads;
- an inner lead reinforcing electrode formed on the inner leads;
- an outer lead reinforcing electrode formed on the outer leads;
- a wiring reinforcing portion formed between the inner leads and the outer leads on the wiring layer;
- and
- a cover coating layer for covering the wiring layer to expose the inner leads and the outer leads;
- wherein the flexible substrate is mounted onto an electronic device by folding a portion to which the wiring reinforcing portion is provided between the inner leads and the outer leads.
A method of manufacturing a flexible circuit substrate, comprising:
- preparing a flexible substrate on one surface of which a metal layer is formed, and then forming a wiring layer forming wirings containing inner leads and outer leads by patterning the metal layer;
- forming a resist film in which opening portions are provided in portions of the inner leads of the wiring layer, a portion containing a folded portion of the wiring layer between the inner leads and the outer leads, and portions of the outer leads respectively;
- forming a metal plating layer in portions of the wiring layer, which are exposed from the opening portions, to obtain an inner lead reinforcing electrode formed on the portions of the inner leads, a wiring reinforcing portion formed on the folded portion of the wiring layer, and an outer lead reinforcing electrode formed on the portions of the outer leads;
- and
- removing the resist film.
Dependencies are inferred from the claim text.