Secondary battery protecting module and lead mounting method
AssigneeMitsumi Electric Co., Ltd.
InventorsItaru Takeda, Tomoyuki Kato, Yasuo Shoji
Life of this patent
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Abstract
In a lead mounting method of mounting, onto a principal surface of a printed board, a lead to be connected to a terminal, a flat lead is prepared which lead has a mounted part to be disposed on the principal surface of the printed board and a connected part to be connected to the terminal. The flat lead is bent into an L shape so that the mounted part and the connected part are perpendicular to each other to obtain an L-shaped lead. The mounted part of the L-shaped lead is connected and fixed onto the principal surface of the printed board by soldering.
Claims7
A lead mounting method of mounting, onto a principal surface of a printed board, a lead to be connected to a terminal, said method comprising the steps of:
- preparing a flat lead which has a mounted part to be disposed on the principal surface of said printed board and a connected part to be connected to said terminal;
- bending said flat lead into an L shape so that said mounted part and said connected part are perpendicular to each other to obtain an L-shaped lead;
- and
- connecting and fixing the mounted part of said L-shaped lead onto the principal surface of said printed board by soldering.
A secondary battery protection module comprising:
- a printed board having a principal surface and a back surface opposite to each other;
- a protection circuit disposed on the principal surface of said printed board for protecting a secondary battery;
- switching means disposed on the principal surface of said printed board for turning on and off discharge and charge of said secondary battery under control of said protection circuit;
- and
- a pair of L-shaped leads disposed on the principal surface of said printed board to be connected to an anode terminal and a cathode terminal of said secondary battery, wherein:
- each of said L-shaped leads is mounted on the principal surface of said printed board by soldering with each of said L-shaped leads preliminarily formed by bending a flat lead into an L shape.
Dependencies are inferred from the claim text.