Back to results
US 2006/0215375 A1Published application
Method and apparatus for routing a differential pair on a printed circuit board
AssigneeMotorola, Inc.
InventorsGary Burhance, John Barron, Peter Bartels
Life of this patent
Estimating the term…
Abstract
A differential pair (200) is provided by routing a printed circuit board (202) having high density interconnect (HDI) substrate (204) with first and second metal layers (212, 218) such that a first runner (206) forms a zigzag pattern using the two metal layers while a second runner (208) forms a second zigzag pattern on the same two metal layers. The first and second zigzag patterns overlap so as to provide orthogonal signal flow.
Claims7
A printed circuit board, comprising:
- at least one high density interconnect (HDI) substrate having first and second metal layers;
- a first runner formed of:
- a first set of upper runner portions etched on the first metal layer at a first predetermined angle;
- a second set of lower runner portions etched on the second metal layer at an angle orthogonal to the first predetermined angle;
- a microvia coupling the first set of upper runner portions to the first set of lower runner portions;
- a second runner formed of:
- a third set of upper runner portions etched on the first metal layer at the first predetermined angle in between the first set of upper runner portions;
- a fourth set of lower runner portions etched on the second metal layer at the angle orthogonal to the first predetermined angle in between the second set of lower runner portions;
- a microvia coupling the third set of upper runner portions to the fourth set of lower runner portions;
- and
- the first and second runners providing a differential pair for transferring a differential signal.
8 more elements
A printed circuit board, comprising:
- at least one high density interconnect (HDI) substrate;
- a first runner forming a first zigzag pattern using two adjacent metal layers of the at least one HDI substrate;
- a second runner forming a second zigzag pattern using the same two metal layers;
- and
- the first and second zigzag patterns overlapping to provide orthogonal signal flow between the two runners.
2 more elements
A method of routing a printed circuit board, comprising:
- providing at least one high density interconnect (HDI) substrate having first and second metal layers;
- routing a first set of runner portions on the first metal layer at a first angle;
- routing a second set of runner portions on the second metal layer at a second angle, the second angle being orthogonal to the first angle;
- interconnecting the first metal layer to the second metal layer to form a differential pair from the first and second sets of runner portions.
1 more element
Dependencies are inferred from the claim text.