Housing of electronic product
AssigneeInventec Corporation
InventorsYung-Chi Yang, Yan Xiong
Life of this patent
Estimating the term…
Abstract
A housing of electronic product includes an accommodating space and at least one heat dissipating opening, wherein the heat dissipating opening is formed on an upper surface of the housing so as to allow a heat dissipating device received in the accommodating space to dissipate heat generated by operation of electronic components received in the accommodating space to improve heat dissipating efficiency.
Claims8
A housing of electronic product, comprising an accommodating space and at least one heat dissipating opening, wherein the heat dissipating opening is formed on an upper surface of the housing so as to allow a heat dissipating device received in the accommodating space to dissipate heat produced by operation of electronic components received in the accommodating space to improve heat dissipating efficiency.
Dependencies are inferred from the claim text.