Exposure apparatus and exposing method and method of manufacturing a printed wiring board
AssigneeHitachi Via Mechanics, Ltd.
InventorsYoshihide Yamaguchi, Hiroshi Oyama
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AssigneeHitachi Via Mechanics, Ltd.
InventorsYoshihide Yamaguchi, Hiroshi Oyama
Estimating the term…
The mask-less exposure apparatus includes: a stage which moves with the substrate having a photosensitive resin layer with sensitivity to ultraviolet radiation formed thereon; a first light source for emitting light containing a wavelength component in the wavelength range of 300 to 410 nm; a first light irradiation optical system for modulating a radiant flux emitted from the first light source based on data of a desired exposure pattern to image a pattern on the photosensitive resin layer; a second light source for emitting light containing a wavelength component in the wavelength range of 450 to 2500 nm; and a second light irradiation optical system for guiding a radiant flux emitted from the second light source to a second light irradiation area that is set so as to include at least a first light irradiation area.
An exposure apparatus for directly exposing an exposure pattern on a substrate to be exposed without using any of photo masks, said exposure apparatus comprising:
An exposure apparatus for directly exposing an exposure pattern on a substrate to be exposed without using any of photo masks, said exposure apparatus comprising:
An exposure apparatus for directly exposing an exposure pattern on a substrate to be exposed without using any of photo masks, said exposure apparatus comprising:
An exposure apparatus for directly exposing an exposure pattern on a substrate to be exposed without using any of photo masks, said exposure apparatus comprising:
An exposing method for directly exposing an exposure pattern to a photosensitive resin layer formed on a substrate to be exposed, comprising:
Dependencies are inferred from the claim text.