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US 2006/0215135 A1Published application
Advanced mask patterning with patterning layer
AssigneeIntel Corporation
InventorsJian Ma, Phil Freiberger, Karmen Yung, Frederick Chen, Chaoyang Li, Steve Mak
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Abstract
An imaging structure such as a mask or reticle may be fabricated using a patterning layer on an imaging layer. The patterning layer may have substantially different etch properties than the imaging layer. A first etch process may be selective of the patterning layer with respect to a resist layer. A second etch process may be selective of the imaging layer with respect to the patterning layer.
Claims23
An imaging structure comprising:
- a substrate having a first set of optical properties;
- an imaging layer on the substrate having a second different set of optical properties and a set of etch properties, the imaging layer comprising patterned features;
- and
- a patterning layer on the imaging layer, the patterning layer having patterning features associated with the patterned features of the imaging layer, the patterning layer having a substantially different set of etch properties.
1 more element
A method of fabricating an imaging structure, comprising:
- providing a structure, the structure comprising:
- a substrate layer with substrate imaging properties;
- an imaging layer on the substrate layer;
- the imaging layer having different imaging properties and further having etch properties;
- a patterning layer on the imaging layer;
- the patterning layer having different etch properties;
- and
- a resist layer on the patterning layer;
- etching features in the patterning layer using a first etch process selective of the patterning layer with respect to the photoresist;
- and
- etching features in the imaging layer using a second different etch process selective of the imaging layer with respect to the patterning layer.
8 more elements
A lithography system, comprising:
- a source of imaging light including light of an imaging wavelength;
- an imaging structure positioned to receive the imaging light;
- and
- a substrate positioner configured to position a substrate to receive light from the imaging structure, and wherein the imaging structure comprises:
- an imaging substrate substantially transparent to light of the imaging wavelength;
- an imaging layer on the imaging substrate, the imaging layer configured to substantially block light of the imaging wavelength;
- and
- a patterning layer on the imaging layer, wherein the patterning layer has a substantially different set of etch properties than the imaging layer.
5 more elements
Dependencies are inferred from the claim text.