Light-emitting device and image reading apparatus
AssigneesNippon Sheet Glass Co., Ltd., Nichia Corporation
InventorsKunihito Sugimoto, Naofumi Sumitani, Masahide Wakisaka
Life of this patent
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Abstract
A light-emitting device includes a light-emitting element and a light-guiding member for causing light from the light-emitting element entering into it through one surface thereof. The light-emitting element includes a lead member with a light-emitting element chip mounted thereon and a molded member to which the lead member is secured. The lead member has a metallic part extending from the molded member, and the metallic part is bent. The thus arranged light-emitting device has an excellent heat release capability. An image reading apparatus using the light-emitting device is also provided.
Claims17
A light-emitting device comprising a light-emitting element and a light-guiding member for causing light from the light-emitting element entering into it through one surface thereof, wherein the light-emitting element includes a lead member with a light-emitting element chip mounted thereon and a molded member to which the lead member is secured;
- the lead member has a metallic part extending from the molded member;
- and the metallic part is bent.
A light-emitting device comprising:
- a light-emitting element;
- and
- a light-guiding member for guiding and emitting therethrough light emitted from the light-emitting element and incident thereon by reflecting or transmitting a portion of the incident light through the light-guiding member;
- wherein the light-emitting element comprises:
- a semiconductor light-emitting element chip having a first electrode and a second electrode:
- a first lead member on which the semiconductor light-emitting element chip is mounted, said first lead member electrically connected to the first electrode of the semiconductor light-emitting element chip;
- a second lead member electrically connected to the second electrode of the semiconductor light-emitting element chip;
- and
- a molded member to which a portion of each of the first lead member and the second lead member is secured;
- wherein
- the first lead member has a lead terminal part for electrical connection to an outside electrode, a mounting part through which the semiconductor light-emitting element chip is mounted on the first lead member, a metallic part for releasing heat generated from the semiconductor light-emitting element chip, and a connection part for connection between the mounting part and the metallic part;
- and
- the metallic part is bent.
A light-emitting device comprising:
- a light-emitting element;
- and
- a light-guiding member for guiding and emitting therethrough light emitted from the light-emitting element and incident thereon by reflecting or transmitting a portion of the incident light through the light-guiding member;
- wherein the light-emitting element comprises:
- a first semiconductor light-emitting element chip that has a peak wavelength in a short wavelength range of the visible spectrum and has a first electrode and a second electrode;
- a second semiconductor light-emitting element chip that has a peak wavelength in a long wavelength range of the visible spectrum and has a first electrode and a second electrode;
- a first lead member on which the first semiconductor light-emitting element chip is mounted, said first lead member electrically connected to the first electrode of the first semiconductor light-emitting element chip;
- a second lead member electrically connected to the second electrode of the first semiconductor light-emitting element chip;
- a third lead member on which the second semiconductor light-emitting element chip is mounted, said third lead member electrically connected to the first electrode of the second semiconductor light-emitting element chip;
- a fourth lead member electrically connected to the second electrode of the second semiconductor light-emitting element chip;
- and
- a molded member to which a portion of each of the first to fourth lead members is secured;
- wherein
- the first lead member has a lead terminal part for electrical connection to an outside electrode, a mounting part through which the first semiconductor light-emitting element chip is mounted on the first lead member, a metallic part for releasing heat generated from the first semiconductor light-emitting element chip, and a connection part for connection between the mounting part and the metallic part;
- and
- the metallic part is exposed from the molded member and bent.
A light-emitting device comprising:
- a light-emitting element;
- and
- a light-guiding member for guiding and emitting therethrough light emitted from the light-emitting element and incident thereon by reflecting or transmitting a portion of the incident light through the light-guiding member;
- wherein the light-emitting element comprises:
- a first semiconductor light-emitting element chip that has a peak wavelength in a short wavelength range of the visible spectrum and has a first electrode and a second electrode;
- a second semiconductor light-emitting element chip that has a peak wavelength in a wavelength range longer than the peak wavelength of the first semiconductor light-emitting element chip and has a first electrode and a second electrode;
- a third semiconductor light-emitting element chip that has a peak wavelength in a wavelength range longer than the peak wavelength of the second semiconductor light-emitting element chip and has a first electrode and a second electrode;
- a first lead member on which the first semiconductor light-emitting element chip is mounted, said first lead member electrically connected to the first electrode of the first semiconductor light-emitting element chip;
- a second lead member electrically connected to the second electrode of the first semiconductor light-emitting element chip;
- a third lead member on which the second semiconductor light-emitting element chip is mounted, said third lead member electrically connected to the first electrode of the second semiconductor light-emitting element chip;
- a fourth lead member electrically connected to the second electrode of the second semiconductor light-emitting element chip;
- a fifth lead member on which the third semiconductor light-emitting element chip is mounted, said third lead member electrically connected to the first electrode of the third semiconductor light-emitting element chip;
- a sixth lead member electrically connected to the second electrode of the third semiconductor light-emitting element chip;
- and
- a molded member to which a portion of each of the first to sixth lead members is secured;
- wherein
- the first lead member has a first lead terminal part for electrical connection to an outside electrode, a first mounting part through which the first semiconductor light-emitting element chip is mounted on the first lead member, a first metallic part for releasing heat generated from the first semiconductor light-emitting element chip, and a first connection part for connection between the first mounting part and the first metallic part;
- the first lead terminal part, the first mounting part, the first connection part and the first metallic part in the first lead member are arranged in this order;
- the third lead member has a second lead terminal part for electrical connection to an outside electrode, a second mounting part through which the second semiconductor light-emitting element chip is mounted on the third lead member, a second metallic part for releasing heat generated from the second semiconductor light-emitting element chip, and a second connection part for connection between the second mounting part and the second metallic part;
- the second lead terminal part, the second mounting part, the second connection part and the second metallic part in the third lead member are arranged in this order;
- and
- the first metallic part and the second metallic part extend outwards from the molded member and are bent.
Dependencies are inferred from the claim text.