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US 2006/0214310 A1Published application
Aluminum cap with electroless nickel/immersion gold
AssigneeChartered Semiconductor Manufacturing Ltd.
InventorMarvin Lo
Life of this patent
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Abstract
A resulting solder bump structure comprising the following steps. A structure having a metal bond pad formed thereover is provided. A patterned cover layer is formed over the structure. The patterned cover layer including an opening exposing a portion of the metal bond pad. The patterned cover layer opening including side walls. A metal cap layer is formed over at least the exposed portion of the metal bond pad and the patterned cover layer side walls. A solder bump is formed over the metal cap layer.
Claims30
A solder bump structure, comprising:
- a structure;
- a metal bond pad on the structure;
- a patterned cover layer over the structure;
- the patterned cover layer including an opening exposing a portion of the metal bond pad;
- the patterned cover layer opening including side walls;
- a metal cap layer over at least the exposed portion of the metal bond pad and the patterned cover layer side walls;
- and
- a solder bump over the metal cap layer to form the solder bump structure.
5 more elements
A solder bump structure, comprising:
- a structure;
- a metal bond pad on the structure;
- a patterned cover layer over the structure;
- the patterned cover layer including an opening exposing a portion of the metal bond pad;
- the patterned cover layer opening including side walls;
- a metal cap layer over at least the exposed portion of the metal bond pad and the patterned cover layer side walls;
- the metal cap layer including a double zincation activated upper surface;
- a electroless nickel layer over the double zincation activated upper surface of the metal cap layer;
- an immersion gold layer over the electroless nickel layer;
- and
- a solder bump over the immersion gold layer to form the solder bump structure.
8 more elements
Dependencies are inferred from the claim text.