# US 2006/0214309 A1 · Integrated circuit and methods of redistributing bondpad locations > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2006/0214309 A1 - Document ID: US20060214309A1 - Status: Published application - Kind: A1 - Application number: 11/445,520 - Filed: 2006-06-02 - Published: 2006-09-28 - Earliest claimed: 2004-07-29 - Inventors: Charles Watkins - Web page: https://patentgrep.com/patent/US20060214309A1 ## CPC - H10W 20/49: Adaptable interconnections, e.g. fuses or antifuses - H10W 74/129: {forming a chip-scale package [CSP]} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Integrated circuits and methods of redistributing bondpad locations are disclosed. In one implementation, a method of redistributing a bondpad location of an integrated circuit includes providing an integrated circuit comprising an inner lead bondpad. A first insulative passivation layer is formed over the integrated circuit. A bondpad-redistribution line is formed over the first insulative passivation layer and in electrical connection with the inner lead bondpad through the first insulative passivation layer. The bondpad-redistribution line includes an outer lead bondpad area. A second insulative passivation layer is formed over the integrated circuit and the bondpad-redistribution line. The second insulative passivation layer is formed to have a sidewall outline at least a portion of which is proximate to and conforms to at least a portion of the bondpad-redistribution line. Other aspects and implementations are contemplated. ## Claims ### Claim at position 1 1-59. (canceled) ### Claim 60 A method of redistributing bondpad locations of an integrated circuit, comprising: providing an integrated circuit comprising a plurality of inner lead bondpads; forming an insulative passivation layer over the integrated circuit; and forming first and second bondpad-redistribution lines over the insulative passivation layer, the first bondpad-redistribution line being in electrical connection with one of the inner lead bondpads through the insulative passivation layer, the second bondpad-redistribution line being in electrical connection with another of the inner lead bondpads through the insulative passivation layer, the second bondpad-redistribution line elevationally overlapping and being insulated from the first bondpad-redistribution line. ### Claim 61 (depends on 60) The method of claim 60 wherein the second bondpad-redistribution line is formed after the first bondpad-redistribution line, and comprising forming a third bondpad-redistribution line over the insulative passivation layer after forming the second bondpad-redistribution line, the third bondpad-redistribution line being in electrical connection with yet another of the inner lead bondpads through the insulative passivation layer, the third bondpad-redistribution line elevationally overlapping at least one of and being insulated from the first and second bondpad-redistribution lines. ### Claim 62 (depends on 61) The method of claim 61 wherein the third bondpad-redistribution line does not overlap the one of the first and second bondpad-redistribution line at any location where the second bondpad-redistribution line overlaps the first bond-pad redistribution line. ### Claim 63 (depends on 61) The method of claim 61 comprising forming a fourth bondpad-redistribution line over the insulative passivation layer after forming the third bondpad-redistribution line, the fourth bondpad-redistribution line being in electrical connection with still another of the inner lead bondpads through the insulative passivation layer, the fourth bondpad-redistribution line elevationally overlapping at least one of and being insulated from the first, second and third bondpad-redistribution lines. ### Claim 64 (depends on 60) The method of claim 60 comprising forming another passivation layer over the first redistribution line, the another insulative passivation layer being formed to have a sidewall outline at least a portion of which is proximate to and conforms to at least a portion of the first bondpad-redistribution line. ### Claim 65 (depends on 60) The method of claim 60 comprising forming another passivation layer over the second redistribution line, the another insulative passivation layer being formed to have a sidewall outline at least a portion of which is proximate to and conforms to at least a portion of the second bondpad-redistribution line. ### Claim 66 An integrated circuit comprising: a plurality of inner lead bondpads; a insulative passivation layer received over the integrated circuit; and first and second bondpad-redistribution lines received over the insulative passivation layer, the first bondpad-redistribution line being in electrical connection with one of the inner lead bondpads through the insulative passivation layer, the second bondpad-redistribution line being in electrical connection with another of the inner lead bondpads through the insulative passivation layer, the second bondpad-redistribution line elevationally overlapping and being insulated from the first bondpad-redistribution line. ### Claim 67 (depends on 66) The integrated circuit of claim 66 wherein the insulative passivation layer comprises a polymer. ### Claim 68 (depends on 67) The integrated circuit of claim 67 wherein the polymer is photoimageable. ### Claim 69 (depends on 68) The integrated circuit of claim 68 wherein the polymer comprises polyimide. ### Claim 70 (depends on 66) The integrated circuit of claim 66 wherein at least one of the first and second bond-pad redistribution lines has a covering insulative passivation layer received thereover, the covering insulative passivation layer having a sidewall outline at least a portion of which is proximate to and conforms to at least a portion of a said one of the first and second bondpad-redistribution lines. ### Claim 71 (depends on 70) The integrated circuit of claim 70 wherein the covering insulative passivation layer is formed to have only a portion of the sidewall outline conforming to only a portion of said one of the first and second bondpad-redistribution lines. ### Claim 72 (depends on 70) The integrated circuit of claim 70 wherein the covering insulative passivation layer is formed to have at least a majority portion of the sidewall outline conforming to at least a majority portion of said one of the first and second bondpad-redistribution lines. ### Claim 73 (depends on 72) The integrated circuit of claim 72 wherein the covering insulative passivation layer is formed to have all of the sidewall outline conforming to all of said one of the first and second bondpad-redistribution lines. ### Claim 74 (depends on 70) The integrated circuit of claim 70 wherein said one of the first and second bondpad-redistribution lines comprises opposing sidewalls, the sidewall outline defining a lateral thickness of the covering insulative passivation layer from each of said sidewalls which is no greater than 20 microns. ### Claim 75 (depends on 74) The integrated circuit of claim 74 wherein the sidewall outline defines a lateral thickness of the covering insulative passivation layer from each of said sidewalls which is no greater than 10 microns. ### Claim 76 (depends on 74) The integrated circuit of claim 74 wherein the covering insulative passivation layer is formed to have all of the sidewall outline conforming to all of said one of the first and second bondpad-redistribution lines. ### Claim 77 (depends on 66) The integrated circuitry of claim 66 wherein the second bondpad-redistribution line crosses the first bondpad-redistribution line at a right angle to the first bondpad-redistribution line. ### Claim 78 (depends on 66) The integrated circuit of claim 66 wherein both of the first and second bond-pad redistribution lines have a respective covering insulative passivation layer received thereover, the covering insulative passivation layer having a plurality of sidewall outlines, at least a portion of the respective sidewall outlines being proximate to and conforming to at least a portion of individual of said first and second bondpad-redistribution lines. ### Claim 79 (depends on 66) The integrated circuit of claim 66 comprising a third bondpad-redistribution line received over the insulative passivation layer, the third bondpad-redistribution line being in electrical connection with yet another of the inner lead bondpads through the insulative passivation layer, the third bondpad-redistribution line elevationally overlapping at least one of and being insulated from the first and second bondpad-redistribution lines. ### Claim 80 (depends on 79) The integrated circuit of claim 79 wherein the third bondpad-redistribution line does not overlap the one of the first and second bondpad-redistribution line at any location where the second bondpad-redistribution line overlaps the first bond-pad redistribution line.