Electronic assembly including multiple substrates

An electronic assembly, comprising:

• a first substrate including a first surface having a first plurality of conductive traces formed on an electrically non-conductive layer;
• a second substrate including a first surface having a second plurality of conductive traces formed thereon and a second surface having a third plurality of conductive traces formed thereon;
• a first electronic component electrically coupled to one or more of the plurality of conductive traces on the first surface of the second substrate;
• and
• a plurality of conductive interconnects, wherein at least one of the conductive interconnects is incorporated within each solder joint that electrically couples one or more of the conductive traces formed on the second surface of the second substrate to one or more of the conductive traces formed on the first substrate, and wherein the first substrate is a stainless steel substrate and the second substrate is a low-temperature co-fired ceramic (LTCC) substrate.

An electronic assembly, comprising:

• a first substrate including a first surface having a first plurality of conductive traces formed on an electrically non-conductive layer;
• a second substrate including a first surface having a second plurality of conductive traces formed thereon and a second surface having a third plurality of conductive traces formed thereon;
• a first electronic component electrically coupled to one or more of the plurality of conductive traces on the first surface of the second substrate;
• and
• a plurality of conductive interconnects, wherein at least one of the conductive interconnects is incorporated within each solder joint that electrically couples one or more of the conductive traces formed on the second surface of the second substrate to one or more of the conductive traces formed on the first substrate, and wherein the first substrate is a stainless steel substrate, the second substrate is a low-temperature co-fired ceramic (LTCC) substrate and the conductive interconnects each include a polymer core and a conductive outer layer with an affinity for solder.