Circuit board and manufacturing method thereof
OwnerKatsufumi Tanaka, Kyoichi Kinoshita +1inventors
InventorsKatsufumi Tanaka, Kyoichi Kinoshita, Eiji Kono
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Abstract
A circuit board has a base plate, an insulating layer and a conductive circuit portion. The insulating layer is fixed to the base plate. The insulating layer includes a resin layer. The conductive circuit portion is fixed to the insulating layer on a side opposite to the base plate. The base plate and the conductive circuit portion have substantially the same coefficient of linear expansion and thickness.
Claims15
A circuit board comprising:
- a base plate;
- an insulating layer fixed to the base plate, wherein the insulating layer includes a resin layer;
- and
- a conductive circuit portion fixed to the insulating layer on a side opposite to the base plate, wherein the base plate and the conductive circuit portion have substantially the same coefficient of linear expansion and thickness.
A method of manufacturing a circuit board including a base plate and a conductive circuit portion having substantially the same coefficient of linear expansion and thickness, the base plate and the conductive circuit portion being connected through an insulating layer, comprising the steps of:
- depositing an inorganic insulating film on either one of the base plate and the conductive circuit portion by chemical vapor deposition, physical vapor deposition or sputtering;
- and
- adhering a surface of the inorganic insulating film to the other of the base plate and the conductive circuit portion with resin.
The method according to claim 15, further comprising the step of:
- fixing a conductive heat spreader to the conductive circuit portion on a side opposite to the insulating layer by soldering, brazing or diffusion bonding.
Dependencies are inferred from the claim text.