US 2006/0214294 A1 · Semiconductor device and a semiconductor device manufacturing method

Abstract

A semiconductor device for fingerprint sensors reduces a mounting area of the semiconductor device and improves a processing capacity of assembling and testing process. The semiconductor device has a functional surface that provides a predetermined function. A semiconductor element has a circuit formation surface on which a plurality of electrodes are formed and a back surface opposite to the circuit formation surface. A part of the circuit formation surface functions as the functional surface. Wiring is formed on the back surface of the semiconductor element. A plurality of connection parts extends between the circuit formation surface and the back surface of the semiconductor element so as to electrically connect the electrodes to the wiring. A plurality of external connection terminals are exposed outside the semiconductor device on a side of the back surface of the semiconductor element.

Claims20

Dependent claims

A semiconductor device having a functional surface that provides a predetermined function, the semiconductor device comprising:

a semiconductor element having a circuit formation surface on which a plurality of electrodes are formed and a back surface opposite to the circuit formation surface, a part of the circuit formation surface functioning as said functional surface;
wiring formed on said back surface of the semiconductor element;
a plurality of connection parts extending between said circuit formation surface and said back surface of said semiconductor element so as to electrically connect the electrodes to said wiring;
and
a plurality of external connection terminals exposed outside said semiconductor device on a side of said back surface of said semiconductor element.

2 more elements

A semiconductor device manufacturing method of manufacturing a plurality of semiconductor devices, each having a circuit formation surface on which a plurality of electrodes are formed and a back surface opposite to the circuit formation surface, a part of the circuit formation surface functioning as said functional surface, the manufacturing method comprising:

forming a plurality of connection parts by an electrically conductive material in each of the semiconductor elements formed in a substrate, the connection parts electrically connected to the respective electrodes and extending between said circuit formation surface and said back surface of each of said semiconductor elements;
forming wiring connected to the connection parts on said back surface in each of said semiconductor elements;
forming external connection terminals connected to the wiring in each of the semiconductor elements;
resin-encapsulating said semiconductor elements in a state where said semiconductor elements are formed in the substrate so that said functional surface and said external connection terminals are exposed;
applying a electrical test to each of said semiconductor device in a state where said semiconductor devices are formed in the substrate;
and
individualizing said semiconductor elements by cutting said substrate along boundaries between the semiconductor elements, thereby forming said plurality of semiconductor devices in a lump.

4 more elements

Dependencies are inferred from the claim text.

Semiconductor device and a semiconductor device manufacturing method

Life of this patent

Semiconductor device and a semiconductor device manufacturing method

Life of this patent

Abstract

Claims20