Semiconductor device

A semiconductor substrate on which a plurality of semiconductor chips are formed, said semiconductor substrate comprising opening portions and frame portions defining peripheries of said opening portions,

• wherein each of said semiconductor chips comprises:
• at least one electric element provided on said frame portion and having at least one electrode terminal;
• and
• a first insulation film formed on said frame portion so that said electrode terminal is partially exposed at said first insulation film to form a plurality of electrode pads.

A semiconductor device comprising:

• a frame-shaped semiconductor chip comprising a semiconductor substrate having an opening portion and a frame portion defining a periphery of said opening portion, at least one electric element provided on said frame portion and having at least one electrode terminal, and a first insulation film formed on said frame portion so that said electrode terminal is partially exposed at said first insulation film to form a plurality of electrode pads;
• at least one mountable semiconductor chip mounted in said opening portion so that said mountable semiconductor chip is apart from side surfaces of said opening portion, said mountable semiconductor chip comprising a first main surface having a second electrode pad and a second main surface opposite to said first main surface;
• a second insulation film formed on said first insulation film and said first main surface, and filled in said opening portion to form a filled portion so that said first and second electrode pads are exposed;
• a first wiring layer electrically connected to at least one of said first and second electrode pads, extending on said second insulation film, and including a plurality of first wiring portions;
• and
• a plurality of first external terminals electrically connected to said plurality of first wiring portions;
• and
• a first sealing portion formed on said first wiring layer and said second insulation film so that said plurality of external terminals are exposed.

A laminated structural body of a plurality of semiconductor devices, each of said semiconductor device comprising:

• a frame-shaped semiconductor chip comprising a semiconductor substrate having an opening portion and a frame portion defining a periphery of said opening portion, at least one electric element provided on said frame portion and having at least one electrode terminal, and a first insulation film formed on said frame portion so that said electrode terminal is partially exposed at said first insulation film to form a plurality of electrode pads;
• at least one mountable semiconductor chip mounted in said opening portion so that said mountable semiconductor chip is apart from side surfaces of said opening portion, said mountable semiconductor chip comprising a first main surface having a second electrode pad and a second main surface opposite to said first main surface;
• a second insulation film formed on said first insulation film and said first main surface, and filled in said opening portion to form a filled portion so that said first and second electrode pads are exposed;
• a first wiring layer electrically connected to at least one of said first and second electrode pads, extending on said second insulation film, and including a plurality of first wiring portions;
• and
• a plurality of first external terminals electrically connected to said plurality of first wiring portions;
• and
• a first sealing portion formed on said first wiring layer and said second insulation film so that said plurality of external terminals are exposed.
• a through hole formed on said filled portion;
• an embedded wiring portion formed in said through hole having an end connected to said first wiring portion;
• a third insulation film that covers said second main surface of said mountable semiconductor chip and a bottom surface of said frame portion so that the other end of said embedded wiring portion is exposed;
• a second wiring layer electrically connected to said other end of said embedded wiring portion and including a plurality of second wiring portions extending on said third insulation film;
• and
• a second insulation layer that covers said second wiring portions so that said second wiring portions are partially exposed,
• wherein said frame-shaped semiconductor chips of said plurality of semiconductor devices have the same shapes, and
• wherein said plurality of semiconductor devices are laminated in such manner that said first external terminals of upper semiconductor device are faced with and bonded to said third electrode pads of lower semiconductor device.