Integrated circuit package
AssigneeTexas Instruments Incorporated
InventorsDolly Wu, Charles Parkhurst
Life of this patent
Estimating the term…
Abstract
An IC package includes a package body of non-conductive material. A conductive heat-sink pad includes an interior pad portion located within an interior of the package body. An exterior pad portion is located external to the package body. The exterior pad portion includes at least two pad pieces that are spaced apart to define at least one channel that separates the at least two pad pieces, the at least two pad pieces being electrically connected with each other. The at least two pad pieces may be flush with an underside surface of the package body or one or more of the pad pieces may extend outwardly from the package body.
Claims24
An integrated circuit (IC) package comprising:
- a package body of a non-conductive material;
- and
- a conductive heat-sink pad comprising an interior pad portion located within an interior of the package body and an exterior pad portion located external to the package body, the exterior pad portion comprising at least two pad pieces that are spaced apart to define at least one channel that separates the at least two pad pieces, the at least two pad pieces being electrically connected with each other within the interior of the package body.
(canceled)
An integrated circuit (IC) package comprising:
- an IC located within an interior of the IC package;
- a heat-sink pad assembly comprising first interior pad portion coupled to and substantially superposed relative to the IC, the pad assembly further comprising an exterior pad portion with at least two external pad pieces that are exposed externally relative to an underside non-conductive surface of the IC package, the externally exposed pad pieces being spatially arranged to define at least one substantially non-conductive channel that separates the exposed pad pieces;
- the heat-sink pad assembly further comprising a second interior pad portion, situated between the first interior pad portion and the exterior pad portion;
- and
- the first and second interior pad portions and the exterior pad portion are conductive.
An integrated circuit (IC) package comprising:
- at least one IC located within a substantially non-conductive material that forms a body of the IC package;
- means for electrically connecting the IC to an externally exposed portion thereof located adjacent a distal surface of the IC package;
- means for dissipating heat from the IC via the means for electrically connecting;
- means for providing a substantially non-conductive path along the exterior of the body of the IC package, the non-conductive path extending between and separating at least two pieces of the externally exposed portion of the means for electrically connecting;
- and
- means for reducing a stress on the IC by providing at least one conductive interface layer coupled to the IC and between the IC and the at least two pieces the at least one conductive interface layer superposed over the at least two pad pieces together.
An integrated circuit (IC) package for at least one IC, the IC package comprising:
- a package body of a non-conductive material;
- a conductive heat-sink pad comprising an interior pad portion located within an interior of the package body and an exterior pad portion located external to the package body, the exterior pad portion comprising at least two pad pieces that are spaced apart to define at least one channel that separates the at least two pad pieces, the at least two pad pieces being electrically connected with each other within the interior of the package body;
- the conductive heat-sink pad further comprises at least one conductive interface layer coupled to the IC, situated between the at least one IC and the at least two pad pieces;
- and
- at least one of the at least one conductive interface layers has apertures.
Dependencies are inferred from the claim text.