Apparatus and method for data capture
OwnerStuart Haden, Robert Skoog +2inventors
InventorsStuart Haden, Robert Skoog, Christopher Freymuth, Robert Wardwell
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Abstract
Various data capture assemblies and methods are provided. In one embodiment, a data capture assembly is provided that includes a bolster plate with an aperture attached to a multi-chip module. A pad array is disposed on the multi-chip module and is exposed through the aperture. An interposer is electrically coupled to the pad array on the multi-chip module, and a translator board is electrically coupled to the interposer. A logical analyzer interface is electrically coupled to the translator board.
Claims20
A data capture assembly, comprising:
- a bolster plate with an aperture attached to a multi-chip module, wherein a pad array on the multi-chip module is exposed through the aperture;
- an interposer electrically coupled to the pad array on the multi-chip module;
- a translator board electrically coupled to the interposer;
- and
- a logical analyzer interface electrically coupled to the translator board.
A method for coupling a logical analyzer to a multi-chip module for data capture, comprising the steps of:
- attaching a bolster plate with an aperture to a multi-chip module;
- exposing a pad array on the multi-chip module through the aperture;
- electrically coupling an interposer to the pad array;
- electrically coupling a translator board to the interposer;
- electrically coupling a logical analyzer interface to the translator board;
- and
- capturing an amount of data from the multi-chip module during a test of the multi-chip module through the interposer, the translator board, and the logical analyzer.
A data capture assembly, comprising:
- bolster plate means for facilitating an attachment of a data capture apparatus to a multi-chip module and for structurally reinforcing at least a portion of the multi-chip module;
- means for exposing a pad array on the multi-chip module through the bolster plate to provide access to the pad array;
- an interposer electrically coupled to the pad array;
- a translator board electrically coupled to the interposer;
- means for pressing the interposer and the translator board against the pad array;
- and
- a logical analyzer interface electrically coupled to the translator board.
Dependencies are inferred from the claim text.