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US 2006/0214283 A1Published application
Semiconductor packaging mold and method of manufacturing semiconductor package using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSang-Uk Kim, Han-Shin Youn
Life of this patent
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Abstract
A semiconductor packaging mold includes first and second mold bodies, a cavity defined by the first and second mold bodies to provide a space for molding a semiconductor package, and a resin bleed preventing formation on a cavity surface of one of the first and second mold bodies to suppress resin bleeding.
Claims25
A semiconductor packaging mold comprising:
- first and second mold bodies;
- a cavity defined by the first and second mold bodies to provide a space to receive a semiconductor package to be molded;
- and
- a non-planar resin bleed preventing formation on a surface of the cavity and formed to correspond to a matingly compatible formation of the semiconductor package to be molded.
1 more element
A method of manufacturing a semiconductor package, the method comprising:
- providing a mold with a first non-planar formation on a mold cavity surface;
- loading the semiconductor package in the cavity of the mold, the semiconductor package having a second non-planar formation corresponding to the first non-planar formation;
- and
- performing a molding process using a sealing resin in a state where the first and second non-planar formations are interlocked to resist resin bleeding therepast.
1 more element
A method of molding a semiconductor package, the method comprising:
- injecting a sealant into a mold cavity containing a semiconductor package while interlocking corresponding first and second closed-shape non-planar formations on a heat spreader of the semiconductor package and on a surface of the mold cavity, respectively, to block a flow of the sealant therepast and thereby leave exposed a surface of the heat spreader bounded by the non-planar surface formations.
A semiconductor packaging mold comprising:
- a mold body;
- a cavity defined by the mold body to provide a space to receive a semiconductor package to be molded;
- and
- a non-planar resin bleed preventing formation on a surface of the cavity.
1 more element
Dependencies are inferred from the claim text.