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AssigneeMitsui Mining & Smelting Co., Ltd.
InventorKen Sakata
Estimating the term…
A flexible printed wiring board comprises a wiring pattern that is made of conductive metal on the surface of an insulating base film and that is protected by bonding an insulating cover layer film to the surface of the wiring pattern in such a manner that the terminal section of the wiring pattern is exposed, wherein the size of the cover layer film is specified previously in such a manner that the shape of the cover layer film is almost same as that of the wiring pattern area from which the terminal section is excluded, from a viewpoint of projection, and the cover layer film is bonded to the wiring pattern area from which the terminal section is excluded. Also disclosed is a method for fabricating a flexible printed wiring board, and a semiconductor device, all that can prevent film edges from peeling and bubbles from being formed in a cover layer film when the cover layer film is bonded to the surface of the wiring pattern.
A flexible printed wiring board comprising a wiring pattern that is made of conductive metal on the surface of an insulating base film and that is protected by bonding an insulating cover layer film to the surface of the wiring pattern in such a manner that the terminal section of the wiring pattern is exposed,
A cover layer film characterized by that the size of the cover layer film is specified previously in such a manner that the shape of the cover layer film is almost same as that of the wiring pattern area formed in the flexible printed wiring board from which the terminal section is excluded, from a viewpoint of projection, and that the cover layer film is punched by using a punch and a punch hole having thus previously specified shape,
A method for fabricating a flexible printed wiring board comprising:
Dependencies are inferred from the claim text.