Stress absorption layer and cylinder solder joint method and apparatus
AssigneeIntel Corporation
InventorJiun Sir
Life of this patent
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Abstract
An apparatus, method, and system for providing a stress absorption layer for integrated circuits includes a stiffening layer adapted to limit flexing. A compliance layer is physically associated with the stiffening layer, with the compliance layer adapted to absorb stress caused by mismatched thermal properties between two materials. A thru hole passes through both the stiffening layer and the compliance layer, with the thru hole being adapted to receive a solder joint. The stress absorption layer contacts both a semiconductor package and a substrate. The solder joint disposed in the thru hole connects the semiconductor package to the substrate.
Claims22
An apparatus comprising:
- a stiffening layer adapted to limit flexing;
- a compliance layer physically associated with the stiffening layer, the compliance layer adapted to absorb stress caused by a mismatched thermal properties between two materials;
- and
- a thru hole passing through both the stiffening layer and the compliance layer, the thru hole adapted to receive a solder joint.
A method comprising:
- providing a thru hole in a mechanical insert;
- contacting the mechanical insert to both a semiconductor package and a substrate;
- and
- forming a solder joint disposed at least in part in said thru hole, to connect the semiconductor package to the substrate.
A method comprising:
- providing a stiffening layer adapted to limit flexing;
- physically associating a compliance layer with the stiffening layer, the compliance layer adapted to absorb stress caused by mismatched thermal properties between two materials;
- and
- forming a thru hole passing through both the stiffening layer and the compliance layer, the thru hole adapted to receive a solder joint.
A system comprising:
- a semiconductor package;
- a substrate;
- a solder joint connecting the semiconductor-package to the substrate;
- a mechanical insert contacting both the semiconductor package and the substrate, the mechanical inert including a thru hole adapted to receive the solder joint;
- a bus coupled to the semiconductor package;
- and
- a mass storage coupled to the bus.
Dependencies are inferred from the claim text.