Contacting device, testing method and corresponding production method

A method for contacting an integrated circuit using a contacting device being comprised of

• a carrier device with a first surface;
• a plurality of first terminal regions on said first surface;
• said plurality of first terminal regions being configured so that signals of a tester device can be fed to said plurality of first terminal regions;
• at least one elastic elevation on said first surface;
• said elastic elevation comprising an upper side;
• and
• a plurality of interconnects, each running from a respective of said first terminal regions to said upper side of said elastic elevation;
• said interconnects having first contact regions located at said upper side of said elastic elevation configured to be contacted electrically with corresponding second contact regions of an integrated circuit;
• said first contact regions comprising first particles for roughening the surface of said first contact regions;
• said method comprising the step of:
• placing contact regions of said integrated circuit onto said first contact regions of said contacting device;
• and
• pressing said contact regions of said integrated circuit onto said first contact regions of said contacting device.

A method for manufacturing a contacting device, comprising the steps of:

• providing a carrier device with a first surface;
• providing a plurality of first terminal regions on said first surface;
• said plurality of first terminal regions being configured so that signals of a tester device can be fed to said plurality of first terminal regions;
• providing a elastic elevation on said surface;
• said elastic elevation comprising an upper side;
• and
• providing a plurality of roughened interconnects, each running from a respective of said first terminal regions to said upper side of said elastic elevation;
• said interconnects having first contact regions located at said upper side of said elastic elevation configured to be contacted electrically with corresponding second contact regions of an integrated circuit;
• said first contact regions comprising first particles for roughening the surface of said first contact regions.