Shield and semiconductor die assembly
AssigneeNokia Corporation
InventorNigel Martin
Life of this patent
Estimating the term…
Abstract
An electronic assembly including a substrate; a semiconductor die; and a shield formed around and mounted to the semiconductor die and located, at least partially, between the semiconductor die and the substrate. A method of assembling an electronic assembly includes selecting a first electronic component assembly from a plurality of different electronic component assemblies, the first electronic component assembly including a semiconductor die with an attached shield; and connecting the selected first electronic component assembly to a substrate to form the electronic assembly. The electronic assembly is formed with the shield already attached to the semiconductor die without having to attached the shield to the semiconductor die or substrate after the semiconductor die is attached to the substrate.
Claims23
An electronic assembly comprising:
- a substrate;
- a semiconductor die;
- and
- a shield mounted to the semiconductor die and located, at least partially, between the semiconductor die and the substrate.
A method of assembling an electronic assembly comprising:
- connecting a shield to a semiconductor die;
- connecting the semiconductor die to a substrate,
- wherein at least a portion of the shield is located between the semiconductor die and the substrate.
A method of assembling an electronic assembly comprising:
- selecting a first electronic component assembly from a plurality of different electronic component assemblies, the first electronic component assembly comprising a semiconductor die with an attached shield;
- and
- connecting the selected first electronic component assembly to a substrate to form the electronic assembly,
- wherein the electronic assembly is formed with the shield already attached to the semiconductor die without having to attached the shield to the semiconductor die or substrate after the semiconductor die is attached to the substrate.
An electronic component assembly comprising:
- a semiconductor die;
- and
- a shield fixedly connected to the semiconductor die,
- wherein the electronic component assembly is sized and shaped to be at least partially mounted in a receiving area of a substrate with at least a portion of the shield being located between the semiconductor die and the substrate.
Dependencies are inferred from the claim text.