Back to results
US 2006/0214277 A1Published application
Semiconductor device and manufacturing method thereof
AssigneeOki Semiconductor Co., Ltd.
InventorYoshihiro Saeki
Life of this patent
Estimating the term…
Abstract
The present invention provides a semiconductor device comprising a lower substrate having at least one wiring pattern formed of a plurality of wirings, a semiconductor chip positioned above the lower substrate and electrically connected to the wirings, an intermediate member which seals the semiconductor chip in columnar form and substantially, and an upper plate which substantially covers a whole upper surface of the intermediate member. A thermal expansion coefficient of the upper plate and a thermal expansion coefficient of the lower substrate are set substantially identical.
Claims16
A semiconductor device comprising:
- a lower substrate having at least one wiring pattern formed of a plurality of wirings;
- a semiconductor chip positioned above the lower substrate and electrically connected to the wirings;
- an intermediate member which seals the semiconductor chip in columnar form and substantially;
- and
- an upper plate which substantially covers a whole upper surface of the intermediate member,
- wherein a thermal expansion coefficient of the upper plate is substantially identical to that of the lower substrate.
3 more elements
Dependencies are inferred from the claim text.