Semiconductor device and manufacturing method thereof
AssigneeKabushiki Kaisha Toshiba
InventorsKazuo Shimokawa, Akira Ushijima
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Abstract
In a semiconductor device manufacturing method which includes a mounting a semiconductor element having a bonding electrode on a substrate, the mounting includes supplying solder paste containing Au—Sn series solder particles onto the substrate, putting the semiconductor element having a film of an Sn alloy or Sn formed on the bonding electrode on the solder paste, and melting the Au—Sn series solder particles and the film of the Sn alloy or Sn to bond the semiconductor element to the substrate.
Claims5
In a semiconductor device manufacturing method which includes a mounting a semiconductor element having a bonding electrode on a substrate, the mounting comprising:
- supplying solder paste containing Au—Sn series solder particles onto the substrate,
- putting the semiconductor element having a film of one of an Sn alloy and Sn formed on the bonding electrode on the solder paste, and
- melting the Au—Sn series solder particles and the film of one of the Sn alloy and Sn to bond the semiconductor element to the substrate.
In a semiconductor device manufacturing method which includes a mounting a semiconductor element having a bonding electrode on a substrate, the mounting comprising:
- supplying solder paste containing Sn-series solder particles onto the substrate,
- putting the semiconductor element having a film of an Au—Sn alloy formed on the bonding electrode on the solder paste, and
- melting the Sn-series solder particles and the film of the Au—Sn alloy to bond the semiconductor element to the substrate.
In a semiconductor device manufacturing method which includes a mounting a semiconductor element having a bonding electrode on a substrate, the mounting comprising:
- supplying an Au—Sn series solder sheet and flux onto the substrate,
- putting the semiconductor element having a film of one of an Sn alloy and Sn formed on the bonding electrode on the solder sheet and flux, and
- melting the solder sheet and the film of one of the Sn alloy and Sn to bond the semiconductor element to the substrate.
In a semiconductor device manufacturing method which includes a mounting a semiconductor element having a bonding electrode on a substrate, the mounting comprising:
- supplying an Sn-series solder sheet and flux onto the substrate,
- putting the semiconductor element having a film of an Au—Sn alloy formed on the bonding electrode on the solder sheet and flux, and
- melting the solder sheet and the film of the Au—Sn alloy to bond the semiconductor element to the substrate.
A semiconductor device comprising:
- a semiconductor element,
- a substrate on which the semiconductor element is mounted, and
- a bonding portion interposed between the semiconductor element and the substrate to bond the semiconductor element to the substrate,
- wherein the bonding portion includes one of an Ni—Sn alloy layer and Ni—Au—Sn alloy layer, an Au—Sn alloy layer having an Sn amount of not less than 22 wt % and an Ni—Sn alloy layer arranged in this order from the semiconductor element side.
Dependencies are inferred from the claim text.